| The G-1 is an electrically non-conductive thermal glue used to affix heatsinks to the CPU/VGA board. It outperforms generic thermal tapes with remarkable thermal conductivity and long-lasting adhesiveness. Already bundled with our latest VGA coolers, such as the Accelero TWIN TURBO II and Accelero Xtreme Plus II, the G-1 is definitely a boon for overclockers. | ||
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 | Outstanding Performance The G-1 is designed to lower the thermal resistance of RAM/VR heatsinks installed on the CPU/VGA board to ensure that heat dissipates from the components more efficiently. Its non-metallic properties prevent short circuits and can be applied generously anywhere without risk. | |
| Hassle-Free Handling In contrast to thermal tapes, the G-1 does not age and once applied, guarantees adhesiveness for over 10 years. Bundled with a mixing wand and container, you can easily apply the G-1 with good control of the thickness and the amount of application. |  | |
 | Easy Removal After applying the G-1, it turns into a form similar to a thermal pad making it easy to remove and not leave any sort of residue behind. | |
G-1
Thermal Glue
| Thermal Conductivity W/(mK) | 4.3 |
|---|---|
| Temperature Range | -45℃ to 200℃ |
| Viscosity (poise) | 320 |
| Gravity | 2.4 g/cm3 at 25℃ |
| Packaging Dimensions (L x W x H) | 90 L x 30 W x 30 H mm |
| Net Weight | 3 sets: 9 g |
| itemnumber | ORACO-TG00201-BL |
| UPC | 0872767004153 |
| Gross Weight | 0.1 kg |
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